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STM-180 Series
- STM-180 Full-Auto Transfer Molding System
Based on STM-120, it is a fully automatic transfer molding equipment with a mold clamping pressure of 180 tons developed for large-size and large-tonnage packaging requirements.
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SWM-90 Series
- SWM-90 Full-Auto WLP Molding System
Suitable for mass production of wafer-level molding, it is equipped with automatic loading and unloading module and rich optional functions according to customer style requirements;
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SCM-60 Series
- SCM-60 Full-Auto Compression Molding System
Suitable for mass production of high-quality and high-capacity products, use high-precision direct-moving servo motor drive system to achieve accurate operation of equipment operation and ensure substrate compression molding accuracy;
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SWM-90 Series
- SWM-90 Manual WLP Molding System
Suitable for wafer-level molding laboratories or small batch production;
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STM-120 Series
- STM-120 Full-Auto Transfer Molding System
STM-120 is a fully automatic transfer molding equipment with a maximum mold clamping pressure of 120ton independently developed by our company, reaching the advanced technical level of similar plastic packaging equipment in the international category.
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STM-120 Series
- STM-120 Manual Transfer Molding System
Suitable for molding laboratories or small batch production
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